DISPLAY APPARATUS
Provided is a display device. The display device includes: a display panel which includes multiple panel bumps, a flexible circuit film which is connected to the display panel and has a mounted chip, and multiple panel lead bondings which connect the display panel and the chip and are extended in a...
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creator | CHO, KYONG SOON |
description | Provided is a display device. The display device includes: a display panel which includes multiple panel bumps, a flexible circuit film which is connected to the display panel and has a mounted chip, and multiple panel lead bondings which connect the display panel and the chip and are extended in a direction. The panel bumps include first panel bumps which are separated from each other along a first row and second panel bumps which are separated from each other along a second row. Each of the second panel bumps are arranged between two adjacent first panel bumps. The panel lead bondings include a first panel lead bondings connected to the first panel bumps and second panel lead bondings connected to the second panel bumps. Each of the first panel lead bondings have a first part having a first thickness and a second part having a second thickness which is less than the first thickness. The second part is a part adjacent to the second panel bumps. |
format | Patent |
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The display device includes: a display panel which includes multiple panel bumps, a flexible circuit film which is connected to the display panel and has a mounted chip, and multiple panel lead bondings which connect the display panel and the chip and are extended in a direction. The panel bumps include first panel bumps which are separated from each other along a first row and second panel bumps which are separated from each other along a second row. Each of the second panel bumps are arranged between two adjacent first panel bumps. The panel lead bondings include a first panel lead bondings connected to the first panel bumps and second panel lead bondings connected to the second panel bumps. Each of the first panel lead bondings have a first part having a first thickness and a second part having a second thickness which is less than the first thickness. 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The display device includes: a display panel which includes multiple panel bumps, a flexible circuit film which is connected to the display panel and has a mounted chip, and multiple panel lead bondings which connect the display panel and the chip and are extended in a direction. The panel bumps include first panel bumps which are separated from each other along a first row and second panel bumps which are separated from each other along a second row. Each of the second panel bumps are arranged between two adjacent first panel bumps. The panel lead bondings include a first panel lead bondings connected to the first panel bumps and second panel lead bondings connected to the second panel bumps. Each of the first panel lead bondings have a first part having a first thickness and a second part having a second thickness which is less than the first thickness. 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The display device includes: a display panel which includes multiple panel bumps, a flexible circuit film which is connected to the display panel and has a mounted chip, and multiple panel lead bondings which connect the display panel and the chip and are extended in a direction. The panel bumps include first panel bumps which are separated from each other along a first row and second panel bumps which are separated from each other along a second row. Each of the second panel bumps are arranged between two adjacent first panel bumps. The panel lead bondings include a first panel lead bondings connected to the first panel bumps and second panel lead bondings connected to the second panel bumps. Each of the first panel lead bondings have a first part having a first thickness and a second part having a second thickness which is less than the first thickness. The second part is a part adjacent to the second panel bumps.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; kor |
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subjects | ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS |
title | DISPLAY APPARATUS |
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