DISPLAY APPARATUS

Provided is a display device. The display device includes: a display panel which includes multiple panel bumps, a flexible circuit film which is connected to the display panel and has a mounted chip, and multiple panel lead bondings which connect the display panel and the chip and are extended in a...

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1. Verfasser: CHO, KYONG SOON
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Sprache:eng ; kor
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creator CHO, KYONG SOON
description Provided is a display device. The display device includes: a display panel which includes multiple panel bumps, a flexible circuit film which is connected to the display panel and has a mounted chip, and multiple panel lead bondings which connect the display panel and the chip and are extended in a direction. The panel bumps include first panel bumps which are separated from each other along a first row and second panel bumps which are separated from each other along a second row. Each of the second panel bumps are arranged between two adjacent first panel bumps. The panel lead bondings include a first panel lead bondings connected to the first panel bumps and second panel lead bondings connected to the second panel bumps. Each of the first panel lead bondings have a first part having a first thickness and a second part having a second thickness which is less than the first thickness. The second part is a part adjacent to the second panel bumps.
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language eng ; kor
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source esp@cenet
subjects ADVERTISING
BASIC ELECTRIC ELEMENTS
CRYPTOGRAPHY
DISPLAY
DISPLAYING
EDUCATION
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LABELS OR NAME-PLATES
PHYSICS
SEALS
SEMICONDUCTOR DEVICES
SIGNS
title DISPLAY APPARATUS
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