ABRASIVE CONTAINING POLYSTYRENE/SILICA COMPOSITE, AND PREPARING METHOD THEREOF

The present invention relates to a polishing agent containing a polystyrene/silica composite, and to a method for manufacturing the polishing agent. The method comprises the steps of embedding silica seed crystal in a polystyrene microsphere; adding a silica precursor with the embedded silica seed c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	QIN HONG YI, KIM, TAE SUNG, AHN, CHI SUNG, KIM, MIN GU, CHO, YU JIN, KIM, HO JOONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a polishing agent containing a polystyrene/silica composite, and to a method for manufacturing the polishing agent. The method comprises the steps of embedding silica seed crystal in a polystyrene microsphere; adding a silica precursor with the embedded silica seed crystal, then hydrolyzing in an aqueous solution of alcohol to grow silica to form a polystyrene/silica composite having a raspberry shape, for the polishing agent of the present invention to be stable while having both hardness of silica and softness of polystyrene.