IMPROVED ALIGN DEVICE AND METHOD OF BONDED SUBSTRATE, AND APPARATUS AND METHOD OF BONDING SUBSTRATES HAVING THE SAME
Disclosed are a device and a method for aligning of an improved bonding substrate and an apparatus and a method for bonding a substrate which comprises the same. The bonding substrate aligning device according to the present invention comprises: a plurality of first aligning devices which is provide...
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| creator | KIM, JI SEOP LEE, JONG SU |
| description | Disclosed are a device and a method for aligning of an improved bonding substrate and an apparatus and a method for bonding a substrate which comprises the same. The bonding substrate aligning device according to the present invention comprises: a plurality of first aligning devices which is provided to an upper part of an upper stage which adsorbs and supports an upper substrate in a vacuum adsorption method, and which controls alignment of the upper substrate; and a plurality of second aligning units which is provided to a lower part of a lower stage which fixedly attaches a lower substrate in the vacuum adsorption method, and which controls the alignment of the lower substrate. The plurality of second aligning devices secondarily checks and corrects the alignment status between the upper substrate and the lower substrate for a bonding substrate in which the upper substrate and the lower substrate are bonded. |
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The bonding substrate aligning device according to the present invention comprises: a plurality of first aligning devices which is provided to an upper part of an upper stage which adsorbs and supports an upper substrate in a vacuum adsorption method, and which controls alignment of the upper substrate; and a plurality of second aligning units which is provided to a lower part of a lower stage which fixedly attaches a lower substrate in the vacuum adsorption method, and which controls the alignment of the lower substrate. The plurality of second aligning devices secondarily checks and corrects the alignment status between the upper substrate and the lower substrate for a bonding substrate in which the upper substrate and the lower substrate are bonded.</description><language>eng ; kor</language><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; FREQUENCY-CHANGING ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PHYSICS ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140610&DB=EPODOC&CC=KR&NR=20140070229A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140610&DB=EPODOC&CC=KR&NR=20140070229A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, JI SEOP</creatorcontrib><creatorcontrib>LEE, JONG SU</creatorcontrib><title>IMPROVED ALIGN DEVICE AND METHOD OF BONDED SUBSTRATE, AND APPARATUS AND METHOD OF BONDING SUBSTRATES HAVING THE SAME</title><description>Disclosed are a device and a method for aligning of an improved bonding substrate and an apparatus and a method for bonding a substrate which comprises the same. 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The bonding substrate aligning device according to the present invention comprises: a plurality of first aligning devices which is provided to an upper part of an upper stage which adsorbs and supports an upper substrate in a vacuum adsorption method, and which controls alignment of the upper substrate; and a plurality of second aligning units which is provided to a lower part of a lower stage which fixedly attaches a lower substrate in the vacuum adsorption method, and which controls the alignment of the lower substrate. The plurality of second aligning devices secondarily checks and corrects the alignment status between the upper substrate and the lower substrate for a bonding substrate in which the upper substrate and the lower substrate are bonded.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF |
| title | IMPROVED ALIGN DEVICE AND METHOD OF BONDED SUBSTRATE, AND APPARATUS AND METHOD OF BONDING SUBSTRATES HAVING THE SAME |
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