IMPROVED ALIGN DEVICE AND METHOD OF BONDED SUBSTRATE, AND APPARATUS AND METHOD OF BONDING SUBSTRATES HAVING THE SAME

IMPROVED ALIGN DEVICE AND METHOD OF BONDED SUBSTRATE, AND APPARATUS AND METHOD OF BONDING SUBSTRATES HAVING THE SAME

Disclosed are a device and a method for aligning of an improved bonding substrate and an apparatus and a method for bonding a substrate which comprises the same. The bonding substrate aligning device according to the present invention comprises: a plurality of first aligning devices which is provide...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, JI SEOP, LEE, JONG SU
Format: Patent
Sprache:eng ; kor
Schlagworte:
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:Disclosed are a device and a method for aligning of an improved bonding substrate and an apparatus and a method for bonding a substrate which comprises the same. The bonding substrate aligning device according to the present invention comprises: a plurality of first aligning devices which is provided to an upper part of an upper stage which adsorbs and supports an upper substrate in a vacuum adsorption method, and which controls alignment of the upper substrate; and a plurality of second aligning units which is provided to a lower part of a lower stage which fixedly attaches a lower substrate in the vacuum adsorption method, and which controls the alignment of the lower substrate. The plurality of second aligning devices secondarily checks and corrects the alignment status between the upper substrate and the lower substrate for a bonding substrate in which the upper substrate and the lower substrate are bonded.