COUPING APPARATUS FOR FRAMES
The present invention relates to a coupling apparatus for detachably coupling two case frames. The coupling apparatus includes at least one mounting protrusion protruding from one frame at a predetermined height and including one side surface; a mounting groove formed on a corresponding location of...
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| creator | JEONG, MIN HWA KIM, DOO RYONG PARK, MAN YOUNG BAEK, SEUNG HYUB YU, JAE WON HWANG, SUNG KYU |
| description | The present invention relates to a coupling apparatus for detachably coupling two case frames. The coupling apparatus includes at least one mounting protrusion protruding from one frame at a predetermined height and including one side surface; a mounting groove formed on a corresponding location of the other case frame to mount the mounting protrusion and including an inner side surface to be touched with the side surface; and a convex surface in which at least one part of the mounting protrusion is formed to be higher than the surface. The inner side surface of the mounting groove and the side surface of the mounting protrusion have a predetermined angle to touch each other. Even if the coupling apparatus is applied to a mounting groove in which tolerance is caused by a molding deviation, the reliability of a product is obtained by providing the predetermined coupling force. |
| format | Patent |
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The coupling apparatus includes at least one mounting protrusion protruding from one frame at a predetermined height and including one side surface; a mounting groove formed on a corresponding location of the other case frame to mount the mounting protrusion and including an inner side surface to be touched with the side surface; and a convex surface in which at least one part of the mounting protrusion is formed to be higher than the surface. The inner side surface of the mounting groove and the side surface of the mounting protrusion have a predetermined angle to touch each other. 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Even if the coupling apparatus is applied to a mounting groove in which tolerance is caused by a molding deviation, the reliability of a product is obtained by providing the predetermined coupling force.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSMISSION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBx9g8N8PRzV3AMCHAMcgwJDVZw8w9ScAty9HUN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgaGJgYGRmaWFsaOxsSpAgD11iGw</recordid><startdate>20140306</startdate><enddate>20140306</enddate><creator>JEONG, MIN HWA</creator><creator>KIM, DOO RYONG</creator><creator>PARK, MAN YOUNG</creator><creator>BAEK, SEUNG HYUB</creator><creator>YU, JAE WON</creator><creator>HWANG, SUNG KYU</creator><scope>EVB</scope></search><sort><creationdate>20140306</creationdate><title>COUPING APPARATUS FOR FRAMES</title><author>JEONG, MIN HWA ; KIM, DOO RYONG ; PARK, MAN YOUNG ; BAEK, SEUNG HYUB ; YU, JAE WON ; HWANG, SUNG KYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20140026983A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSMISSION</topic><toplevel>online_resources</toplevel><creatorcontrib>JEONG, MIN HWA</creatorcontrib><creatorcontrib>KIM, DOO RYONG</creatorcontrib><creatorcontrib>PARK, MAN YOUNG</creatorcontrib><creatorcontrib>BAEK, SEUNG HYUB</creatorcontrib><creatorcontrib>YU, JAE WON</creatorcontrib><creatorcontrib>HWANG, SUNG KYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JEONG, MIN HWA</au><au>KIM, DOO RYONG</au><au>PARK, MAN YOUNG</au><au>BAEK, SEUNG HYUB</au><au>YU, JAE WON</au><au>HWANG, SUNG KYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COUPING APPARATUS FOR FRAMES</title><date>2014-03-06</date><risdate>2014</risdate><abstract>The present invention relates to a coupling apparatus for detachably coupling two case frames. The coupling apparatus includes at least one mounting protrusion protruding from one frame at a predetermined height and including one side surface; a mounting groove formed on a corresponding location of the other case frame to mount the mounting protrusion and including an inner side surface to be touched with the side surface; and a convex surface in which at least one part of the mounting protrusion is formed to be higher than the surface. The inner side surface of the mounting groove and the side surface of the mounting protrusion have a predetermined angle to touch each other. Even if the coupling apparatus is applied to a mounting groove in which tolerance is caused by a molding deviation, the reliability of a product is obtained by providing the predetermined coupling force.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TRANSMISSION |
| title | COUPING APPARATUS FOR FRAMES |
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