METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION

A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BJORKMAN CLAES H, RAMASWAMI SESHADRI, SCHUEGRAF KLAUS, RICE MICHAEL R, SALEK MOHSEN S
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!