CLEANER WAFER AND METHOD FOR CLEANING

PURPOSE: A cleaner wafer and a method for cleaning the surface of a robot hand using the same are provided to automatically remove foreign materials or fine dust from the surface of the robot hand by the self-adhesion of a self-adhesive layer formed on the lower side of the cleaner wafer. CONSTITUTION: A case individually receives a plurality of wafers. A robot hand loads the wafers from the case on a receiving space in a processing section. A self-adhesive layer (10) is formed on the lower side of a cleaner wafer (1). After the lower side of the corresponding wafer secures a constant thickness, the self-adhesive layer is formed with the secured thickness. The self-adhesive layer removes fine dust or foreign materials from the surface of the robot hand by a self-adhesion.