POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

PURPOSE: A positive photosensitive resin composition is provided to improve the adhesiveness between a lower substrate and a film formed with a photosensitive resin film, and to be able to effectively suppress the exfoliation of a metal layer deposited on the film. CONSTITUTION: A positive photosensitive resin composition comprises (A) alkali soluble resin selected from polybenzoxazole precursor, polyimide precursor or their combination; (B) a photosensitive diazoquinone compound; (C) a compound represented by Chemical 1; and (D) solvent. Herein X5 and X6 are identical or different, and -S-, -C (=O)-, -C (=S)-, substituted or non-substituted C1-30 alkylene, substituted or non-substituted C6-30 cycloalkylene, or substituted or non-substituted C6-30 cycloallylene, respectively, L1 is a single bond, disulfide bond (-S-S-), -S (=O)-, -C (=O)-, or -C (=S)-. [Reference numerals] (AA) Ag adhesion test (after stored at room temperature); (BB) Ag adhesion test (after stored at 85/85 for 168 hours); (CC,DD,EE,FF,GG,HH,II,JJ,KK,LL,MM,NN) Example; (OO,PP,QQ,RR) Comparative example