RESIN COMPOSITION FOR FIXING A LEAD OF SEMICONDUCTOR AND THE TAPE FOR FIXING A LEAD
PURPOSE: A resin composition for fixing a semiconductor lead is provided to offer high temperature attachment and high voltage reliability, and to improve heat-proof resistance and physical rigidity by increasing the crosslinking density of an adhesive. CONSTITUTION: A resin composition for fixing a...
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| creator | SHIN, JAE HAN UHM, TAI SOO CHA, SE YOUNG JEON, HAE SANG |
| description | PURPOSE: A resin composition for fixing a semiconductor lead is provided to offer high temperature attachment and high voltage reliability, and to improve heat-proof resistance and physical rigidity by increasing the crosslinking density of an adhesive. CONSTITUTION: A resin composition for fixing a semiconductor lead contains an epoxy resin, a curing agent, a thermoplastic resin, an additive, and a phosphorus compound denoted by chemical formula 1. In the chemical formula 1, R1-R15 are the same or different, and are independently H or a C1-6 alkyl group. A lead fixing tape using the resin composition for fixing the semiconductor lead is obtained by coating the resin composition on a supporting base film, and laminating a protective film on the coated composition. |
| format | Patent |
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| language | eng ; kor |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | RESIN COMPOSITION FOR FIXING A LEAD OF SEMICONDUCTOR AND THE TAPE FOR FIXING A LEAD |
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