RESIN COMPOSITION FOR FIXING A LEAD OF SEMICONDUCTOR AND THE TAPE FOR FIXING A LEAD

PURPOSE: A resin composition for fixing a semiconductor lead is provided to offer high temperature attachment and high voltage reliability, and to improve heat-proof resistance and physical rigidity by increasing the crosslinking density of an adhesive. CONSTITUTION: A resin composition for fixing a...

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Bibliographische Detailangaben
Hauptverfasser:	SHIN, JAE HAN, UHM, TAI SOO, CHA, SE YOUNG, JEON, HAE SANG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE: A resin composition for fixing a semiconductor lead is provided to offer high temperature attachment and high voltage reliability, and to improve heat-proof resistance and physical rigidity by increasing the crosslinking density of an adhesive. CONSTITUTION: A resin composition for fixing a semiconductor lead contains an epoxy resin, a curing agent, a thermoplastic resin, an additive, and a phosphorus compound denoted by chemical formula 1. In the chemical formula 1, R1-R15 are the same or different, and are independently H or a C1-6 alkyl group. A lead fixing tape using the resin composition for fixing the semiconductor lead is obtained by coating the resin composition on a supporting base film, and laminating a protective film on the coated composition.