LIGHT EMITTING DIODE PACKAGE, AND METHOD FOR MANUFACTURING THE LIGHT EMITTING DEVICE PACKAGE

LIGHT EMITTING DIODE PACKAGE, AND METHOD FOR MANUFACTURING THE LIGHT EMITTING DEVICE PACKAGE

PURPOSE: A light emitting device package and a method for manufacturing the light emitting device package are provided to improve the brightness of a backlight unit by increasing the reflection rate to a light guide plate. CONSTITUTION: A body part (30) includes a metal having a first surface. The f...

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1. Verfasser: CHO, HYUN RYONG
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHO, HYUN RYONG
description PURPOSE: A light emitting device package and a method for manufacturing the light emitting device package are provided to improve the brightness of a backlight unit by increasing the reflection rate to a light guide plate. CONSTITUTION: A body part (30) includes a metal having a first surface. The first surface includes a mounting surface. An insulating layer (70) surrounds a part of the body part. A line layer (10) is arranged on the insulating layer. The line layer and the insulating layer have the same pattern on the first surface.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LIGHT EMITTING DIODE PACKAGE, AND METHOD FOR MANUFACTURING THE LIGHT EMITTING DEVICE PACKAGE
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