SEMICONDUCTOR CONSTRUCTIONS; AND METHODS FOR PROVIDING ELECTRICALLY CONDUCTIVE MATERIAL WITHIN OPENINGS

Some embodiments include methods for depositing copper-containing material utilizing physical vapor deposition of the copper-containing material while keeping a temperature of the deposited copper-containing material at greater than 100° C. Some embodiments include methods in which openings are line...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LINDGREN JOE, COLLINS DALE W
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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