METAL SUBSTRATE HAVING MULTI REFLECTIVE LAYER AND LIGHTING EMITTING DIODE PACKAGE USING THE SAME

METAL SUBSTRATE HAVING MULTI REFLECTIVE LAYER AND LIGHTING EMITTING DIODE PACKAGE USING THE SAME

PURPOSE: A heat radiation substrate with a multilayer reflection surface and a light emitting diode package using the same are provided to improve the application of a device by forming a multilayer reflection part under the heat radiation substrate. CONSTITUTION: A reflection groove(11) is formed i...

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1. Verfasser: JANG, JONG JIN
Format: Patent
Sprache:eng ; kor
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PURPOSE: A heat radiation substrate with a multilayer reflection surface and a light emitting diode package using the same are provided to improve the application of a device by forming a multilayer reflection part under the heat radiation substrate. CONSTITUTION: A reflection groove(11) is formed in a chip mounting region of a heat radiation substrate. The reflection groove with a top opening part which is larger than a bottom part is formed in the mounting region. Mounting grooves(12a,12b,12c) with a top opening part which is larger than a bottom part are formed in the reflection groove. The mounting grooves include inclined surfaces between the top opening part and the bottom part. The inclined surface of the reflection groove is used as a first reflection layer.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METAL SUBSTRATE HAVING MULTI REFLECTIVE LAYER AND LIGHTING EMITTING DIODE PACKAGE USING THE SAME
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