RFID INLAY, CARD CONTAINING THESAME AND METHOD FOR MANUFACTURING THEREOF

PURPOSE: An RFID(Radio Frequency ID) inlay, a card including the same, and a producing method thereof are provided to prevent the breakage of an IC chip or a joint between the IC chip and an antenna by being produced without applying high temperature and high pressure. CONSTITUTION: An antenna layer...

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Hauptverfasser: KIM, MYUNG KYU, PARK, SUN BYOUNG, YOON, JUNG WOO, KIM, KYUNG HUN, KANG, DUK IN, OH, CHANG HWAN, YE, JUN YONG, LEE, EUN DUK, RHEE, TAI HYUNG
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Sprache:eng ; kor
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creator KIM, MYUNG KYU
PARK, SUN BYOUNG
YOON, JUNG WOO
KIM, KYUNG HUN
KANG, DUK IN
OH, CHANG HWAN
YE, JUN YONG
LEE, EUN DUK
RHEE, TAI HYUNG
description PURPOSE: An RFID(Radio Frequency ID) inlay, a card including the same, and a producing method thereof are provided to prevent the breakage of an IC chip or a joint between the IC chip and an antenna by being produced without applying high temperature and high pressure. CONSTITUTION: An antenna layer(100) includes a base(110) and an antenna(130). An IC chip layer(200) is connected to the antenna layer and includes an IC chip(210) protruding on the upper part of the antenna layer and a UV curable resin layer(230) covering the protrusion. UV curable resin of the UV curable resin layer is composed of monomer(18-80 weight%) and photoinitiator(0.1-15 weight%). One side of the UV curable resin layer protects the protrusion of the IC chip and covers the front of the antenna layer. The other side of the UV curable resin layer has a flat surface.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20120093805A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20120093805A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20120093805A3</originalsourceid><addsrcrecordid>eNrjZPAIcvN0UfD083GM1FFwdgxyUXD29wtx9PTz9HNXCPFwDXb0dVVw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkNgioKcvV342FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgaGRgYGlsYWBqaOxsSpAgCDUy1c</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RFID INLAY, CARD CONTAINING THESAME AND METHOD FOR MANUFACTURING THEREOF</title><source>esp@cenet</source><creator>KIM, MYUNG KYU ; PARK, SUN BYOUNG ; YOON, JUNG WOO ; KIM, KYUNG HUN ; KANG, DUK IN ; OH, CHANG HWAN ; YE, JUN YONG ; LEE, EUN DUK ; RHEE, TAI HYUNG</creator><creatorcontrib>KIM, MYUNG KYU ; PARK, SUN BYOUNG ; YOON, JUNG WOO ; KIM, KYUNG HUN ; KANG, DUK IN ; OH, CHANG HWAN ; YE, JUN YONG ; LEE, EUN DUK ; RHEE, TAI HYUNG</creatorcontrib><description>PURPOSE: An RFID(Radio Frequency ID) inlay, a card including the same, and a producing method thereof are provided to prevent the breakage of an IC chip or a joint between the IC chip and an antenna by being produced without applying high temperature and high pressure. CONSTITUTION: An antenna layer(100) includes a base(110) and an antenna(130). An IC chip layer(200) is connected to the antenna layer and includes an IC chip(210) protruding on the upper part of the antenna layer and a UV curable resin layer(230) covering the protrusion. UV curable resin of the UV curable resin layer is composed of monomer(18-80 weight%) and photoinitiator(0.1-15 weight%). One side of the UV curable resin layer protects the protrusion of the IC chip and covers the front of the antenna layer. The other side of the UV curable resin layer has a flat surface.</description><language>eng ; kor</language><subject>CALCULATING ; COMPUTING ; COUNTING ; HANDLING RECORD CARRIERS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120823&amp;DB=EPODOC&amp;CC=KR&amp;NR=20120093805A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120823&amp;DB=EPODOC&amp;CC=KR&amp;NR=20120093805A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, MYUNG KYU</creatorcontrib><creatorcontrib>PARK, SUN BYOUNG</creatorcontrib><creatorcontrib>YOON, JUNG WOO</creatorcontrib><creatorcontrib>KIM, KYUNG HUN</creatorcontrib><creatorcontrib>KANG, DUK IN</creatorcontrib><creatorcontrib>OH, CHANG HWAN</creatorcontrib><creatorcontrib>YE, JUN YONG</creatorcontrib><creatorcontrib>LEE, EUN DUK</creatorcontrib><creatorcontrib>RHEE, TAI HYUNG</creatorcontrib><title>RFID INLAY, CARD CONTAINING THESAME AND METHOD FOR MANUFACTURING THEREOF</title><description>PURPOSE: An RFID(Radio Frequency ID) inlay, a card including the same, and a producing method thereof are provided to prevent the breakage of an IC chip or a joint between the IC chip and an antenna by being produced without applying high temperature and high pressure. CONSTITUTION: An antenna layer(100) includes a base(110) and an antenna(130). An IC chip layer(200) is connected to the antenna layer and includes an IC chip(210) protruding on the upper part of the antenna layer and a UV curable resin layer(230) covering the protrusion. UV curable resin of the UV curable resin layer is composed of monomer(18-80 weight%) and photoinitiator(0.1-15 weight%). One side of the UV curable resin layer protects the protrusion of the IC chip and covers the front of the antenna layer. The other side of the UV curable resin layer has a flat surface.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>HANDLING RECORD CARRIERS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAIcvN0UfD083GM1FFwdgxyUXD29wtx9PTz9HNXCPFwDXb0dVVw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkNgioKcvV342FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgaGRgYGlsYWBqaOxsSpAgCDUy1c</recordid><startdate>20120823</startdate><enddate>20120823</enddate><creator>KIM, MYUNG KYU</creator><creator>PARK, SUN BYOUNG</creator><creator>YOON, JUNG WOO</creator><creator>KIM, KYUNG HUN</creator><creator>KANG, DUK IN</creator><creator>OH, CHANG HWAN</creator><creator>YE, JUN YONG</creator><creator>LEE, EUN DUK</creator><creator>RHEE, TAI HYUNG</creator><scope>EVB</scope></search><sort><creationdate>20120823</creationdate><title>RFID INLAY, CARD CONTAINING THESAME AND METHOD FOR MANUFACTURING THEREOF</title><author>KIM, MYUNG KYU ; PARK, SUN BYOUNG ; YOON, JUNG WOO ; KIM, KYUNG HUN ; KANG, DUK IN ; OH, CHANG HWAN ; YE, JUN YONG ; LEE, EUN DUK ; RHEE, TAI HYUNG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20120093805A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2012</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>HANDLING RECORD CARRIERS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, MYUNG KYU</creatorcontrib><creatorcontrib>PARK, SUN BYOUNG</creatorcontrib><creatorcontrib>YOON, JUNG WOO</creatorcontrib><creatorcontrib>KIM, KYUNG HUN</creatorcontrib><creatorcontrib>KANG, DUK IN</creatorcontrib><creatorcontrib>OH, CHANG HWAN</creatorcontrib><creatorcontrib>YE, JUN YONG</creatorcontrib><creatorcontrib>LEE, EUN DUK</creatorcontrib><creatorcontrib>RHEE, TAI HYUNG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, MYUNG KYU</au><au>PARK, SUN BYOUNG</au><au>YOON, JUNG WOO</au><au>KIM, KYUNG HUN</au><au>KANG, DUK IN</au><au>OH, CHANG HWAN</au><au>YE, JUN YONG</au><au>LEE, EUN DUK</au><au>RHEE, TAI HYUNG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RFID INLAY, CARD CONTAINING THESAME AND METHOD FOR MANUFACTURING THEREOF</title><date>2012-08-23</date><risdate>2012</risdate><abstract>PURPOSE: An RFID(Radio Frequency ID) inlay, a card including the same, and a producing method thereof are provided to prevent the breakage of an IC chip or a joint between the IC chip and an antenna by being produced without applying high temperature and high pressure. CONSTITUTION: An antenna layer(100) includes a base(110) and an antenna(130). An IC chip layer(200) is connected to the antenna layer and includes an IC chip(210) protruding on the upper part of the antenna layer and a UV curable resin layer(230) covering the protrusion. UV curable resin of the UV curable resin layer is composed of monomer(18-80 weight%) and photoinitiator(0.1-15 weight%). One side of the UV curable resin layer protects the protrusion of the IC chip and covers the front of the antenna layer. The other side of the UV curable resin layer has a flat surface.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; kor
recordid cdi_epo_espacenet_KR20120093805A
source esp@cenet
subjects CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
title RFID INLAY, CARD CONTAINING THESAME AND METHOD FOR MANUFACTURING THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T04%3A20%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM,%20MYUNG%20KYU&rft.date=2012-08-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20120093805A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true