PAD CONDITIONER OF CHEMICAL MECHANICAL POLISHING EQUIPMENT AND METHOD FOR MANUFACTURING THEREOF
PURPOSE: A manufacturing method of a pad conditioner for a chemical mechanical polishing apparatus is provided to reduce a failure rate by performing masking with screen printing. CONSTITUTION: A mask for forming a pattern, in which a plurality of electrodeposition holes(18) adheres closely to a rou...
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| creator | JANG, JAE BOK CHOI, KWANG JIN |
| description | PURPOSE: A manufacturing method of a pad conditioner for a chemical mechanical polishing apparatus is provided to reduce a failure rate by performing masking with screen printing. CONSTITUTION: A mask for forming a pattern, in which a plurality of electrodeposition holes(18) adheres closely to a round metal support plate. A conditioning area is formed by masking an insulator ink(16) on a surface of the supporting plate through screen printing. Diamond particles(20) for electrodeposition is dipped in a plating liquid at the electrodeposition hole in the conditioning area and becomes electrodepositioned. The masking is removed by using a chemical precipitation method. A nickel plating layer(22) is formed by dipping a conditioner main body in a nickel plating liquid. |
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CONSTITUTION: A mask for forming a pattern, in which a plurality of electrodeposition holes(18) adheres closely to a round metal support plate. A conditioning area is formed by masking an insulator ink(16) on a surface of the supporting plate through screen printing. Diamond particles(20) for electrodeposition is dipped in a plating liquid at the electrodeposition hole in the conditioning area and becomes electrodepositioned. The masking is removed by using a chemical precipitation method. 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CONSTITUTION: A mask for forming a pattern, in which a plurality of electrodeposition holes(18) adheres closely to a round metal support plate. A conditioning area is formed by masking an insulator ink(16) on a surface of the supporting plate through screen printing. Diamond particles(20) for electrodeposition is dipped in a plating liquid at the electrodeposition hole in the conditioning area and becomes electrodepositioned. The masking is removed by using a chemical precipitation method. A nickel plating layer(22) is formed by dipping a conditioner main body in a nickel plating liquid.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | PAD CONDITIONER OF CHEMICAL MECHANICAL POLISHING EQUIPMENT AND METHOD FOR MANUFACTURING THEREOF |
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