DIE BONDER INCORPORATING DUAL-HEAD DISPENSER

PURPOSE: A die bonder for including a dual-head dispenser is provided to reduce the total costs of a machine by using reduced machine footprints having a simple and short anvil block design as well as one workstation. CONSTITUTION: A first dispensing head(12) and a second dispensing head(14) distrib...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WONG YIU YAN, TANG YEN HSI, WAN HOK MAN, LAM KUI KAM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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