DIE BONDER INCORPORATING DUAL-HEAD DISPENSER

DIE BONDER INCORPORATING DUAL-HEAD DISPENSER

PURPOSE: A die bonder for including a dual-head dispenser is provided to reduce the total costs of a machine by using reduced machine footprints having a simple and short anvil block design as well as one workstation. CONSTITUTION: A first dispensing head(12) and a second dispensing head(14) distrib...

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Hauptverfasser: WONG YIU YAN, TANG YEN HSI, WAN HOK MAN, LAM KUI KAM
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator WONG YIU YAN
TANG YEN HSI
WAN HOK MAN
LAM KUI KAM
description PURPOSE: A die bonder for including a dual-head dispenser is provided to reduce the total costs of a machine by using reduced machine footprints having a simple and short anvil block design as well as one workstation. CONSTITUTION: A first dispensing head(12) and a second dispensing head(14) distribute adhesive. The first dispensing head is arranged on a first position setting table(16). The second dispensing head is arranged on a second position setting table(17). A single optical system(18) is arranged on the first position setting table or the second position setting table. First and second nozzles(20,22) respectively are arranged at one end of the first and second dispensing heads.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DIE BONDER INCORPORATING DUAL-HEAD DISPENSER
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