CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

PURPOSE: A circuit device and a manufacturing method thereof are provided to discharge a large current passing through a first circuit device to the outside by mounting the first circuit device on the upper side of an island unit and fixing the lower side of the island unit to the upper side of a fi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HORIUCHI FUMIO, INAGAKI YUHKI, KUDO KIYOAKI, SAKURAI AKIRA, MASHIMO SHIGEAKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A circuit device and a manufacturing method thereof are provided to discharge a large current passing through a first circuit device to the outside by mounting the first circuit device on the upper side of an island unit and fixing the lower side of the island unit to the upper side of a first substrate. CONSTITUTION: A lead(18) has a lead unit(32) and an island unit(28) on the upper side of a first substrate. A first circuit device is mounted on the island unit. A second circuit device is electrically connected to the first circuit device. A second substrate is connected to the lead at an overlapped area with the first substrate. The substrate and the devices are coated with sealing resin(16).