METHOD OF ANALYZING PLATING SOLUTION AND APPARATUS FOR PERFORMING THE METHOD
PURPOSE: A method for analyzing plating solution and an apparatus thereof are provided to analyze quantitatively and qualitatively with high accuracy in real time and enhance processing problems within prompt time. CONSTITUTION: A method for analyzing plating solution is as follows. A sample for the...
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| creator | SUNG, YONG IK |
| description | PURPOSE: A method for analyzing plating solution and an apparatus thereof are provided to analyze quantitatively and qualitatively with high accuracy in real time and enhance processing problems within prompt time. CONSTITUTION: A method for analyzing plating solution is as follows. A sample for the plating solution is collected(S10). The collected sample is separated by capillary electrophoresis in online(S20). The separated sample is analyzed quantitatively and qualitatively(S30). The analyzed data is processed and controlled(S40). The plating solution composition is changed. |
| format | Patent |
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CONSTITUTION: A method for analyzing plating solution is as follows. A sample for the plating solution is collected(S10). The collected sample is separated by capillary electrophoresis in online(S20). The separated sample is analyzed quantitatively and qualitatively(S30). The analyzed data is processed and controlled(S40). The plating solution composition is changed.</description><language>eng ; kor</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; METALLURGY ; PHYSICS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TESTING</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120309&DB=EPODOC&CC=KR&NR=20120021498A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120309&DB=EPODOC&CC=KR&NR=20120021498A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUNG, YONG IK</creatorcontrib><title>METHOD OF ANALYZING PLATING SOLUTION AND APPARATUS FOR PERFORMING THE METHOD</title><description>PURPOSE: A method for analyzing plating solution and an apparatus thereof are provided to analyze quantitatively and qualitatively with high accuracy in real time and enhance processing problems within prompt time. CONSTITUTION: A method for analyzing plating solution is as follows. A sample for the plating solution is collected(S10). The collected sample is separated by capillary electrophoresis in online(S20). The separated sample is analyzed quantitatively and qualitatively(S30). The analyzed data is processed and controlled(S40). 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CONSTITUTION: A method for analyzing plating solution is as follows. A sample for the plating solution is collected(S10). The collected sample is separated by capillary electrophoresis in online(S20). The separated sample is analyzed quantitatively and qualitatively(S30). The analyzed data is processed and controlled(S40). The plating solution composition is changed.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TESTING |
| title | METHOD OF ANALYZING PLATING SOLUTION AND APPARATUS FOR PERFORMING THE METHOD |
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