SUBMODULE AND POWER SEMICONDUCTOR MODULE

PURPOSE: A power semiconductor module and a sub module are provided to increase the efficiency of a clamping circuit by arranging a shock absorbing diode between driving terminals. CONSTITUTION: A conductor track(24) is arranged on one part of a carrier(6). A monolithically integrated semiconductor structure(26) is formed on the conductor track. A contact part forming area(50) connects the semiconductor structure to the conductor track. Integrated inert resistance(40) is connected to a first and a second connection unit and a interval between the connection units. An integrated double diode structure(38) is connected to a third connection unit and the interval between the second connection unit and the third connection unit.