POP SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BETWEEN TWO PACKAGE SUBSTRATES

PURPOSE: A POP semiconductor package having spacers arranged between two package substrates is provided to prevent a short circuit due to the contact of solder balls by maintaining an interval of inner solder balls which are arranged between two substrates. CONSTITUTION: A first semiconductor package(110) includes a first substrate and a first semiconductor chip which is mounted on the first substrate. A second semiconductor package(120) is laminated on the first semiconductor package. The second semiconductor package includes a second substrate and the second semiconductor chip which is mounted on the second substrate. A plurality of spacers(128) regularly keeps an interval between the first substrate and the second substrate wile being arranged between the first substrate and the second substrate. A plurality of spacers is projected from the bottom surface of the second substrate to the first substrate.