BRIDGE PRINTED CIRCUIT BOARD AND STACKED DIE SEMICONDUCTOR DEVICE USING THE SAME

PURPOSE: A bridge PCB and a stacked die semiconductor device using the same are provided to reduce the thickness of a stack using a bridge PCB for leading a top semiconductor die which is stacked in a low semiconductor die. CONSTITUTION: A groove(113) is formed in a base member(111) to lead a semico...

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Hauptverfasser:	KIM, JEONG DEOK, KIM, SEONG KEUN, YU, JAE HWANG, NOH, JAE YEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	KIM, JEONG DEOK KIM, SEONG KEUN YU, JAE HWANG NOH, JAE YEON
description	PURPOSE: A bridge PCB and a stacked die semiconductor device using the same are provided to reduce the thickness of a stack using a bridge PCB for leading a top semiconductor die which is stacked in a low semiconductor die. CONSTITUTION: A groove(113) is formed in a base member(111) to lead a semiconductor die. An inner fin(115) is formed in the side of a groove along the edge of the groove. An outer pin(117) is formed in the side or the upper side of the base member a long the edge of the base member. A connection line(119) connects the inner fin and the outer pin. The inner fin, the outer pin, and the connection line are integrally formed.
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language	eng ; kor
recordid	cdi_epo_espacenet_KR20110122976A
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	BRIDGE PRINTED CIRCUIT BOARD AND STACKED DIE SEMICONDUCTOR DEVICE USING THE SAME
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