METHODS OF FORMING A THERMAL CONDUCTION REGION IN A SEMICONDUCTOR STRUCTURE AND STRUCTURES RESULTING THEREFROM

PURPOSE: A method for forming a thermal conduction region in a semiconductor structure and the related semiconductor structure are provided to improve the heat dissipation performance of a semiconductor structure by providing a heat transfer path to discharge heat from the surface of a semiconductor device. CONSTITUTION: A heat transfer layer(202) is formed on a substrate(204). A semiconductor layer(206) is formed on the heat transfer layer. A mask layer(208) is formed on the semiconductor layer. Isolation regions(210,212) are formed on the heat transfer layer. A heat transfer region is formed on the isolation region.