HIGH FREQUENCY PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: A high frequency package and a manufacturing method thereof are provided to protect an individual device from an external impact by including a first molding unit by molding the individual device with non-conductive resin materials. CONSTITUTION: A grounding pad(11) is formed on the upper s...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YIM, NAM GYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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