HIGH FREQUENCY PACKAGE AND METHOD FOR MANUFACTURING THE SAME
PURPOSE: A high frequency package and a manufacturing method thereof are provided to protect an individual device from an external impact by including a first molding unit by molding the individual device with non-conductive resin materials. CONSTITUTION: A grounding pad(11) is formed on the upper s...
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| creator | YIM, NAM GYUN |
| description | PURPOSE: A high frequency package and a manufacturing method thereof are provided to protect an individual device from an external impact by including a first molding unit by molding the individual device with non-conductive resin materials. CONSTITUTION: A grounding pad(11) is formed on the upper side of a circuit board(10). An electronic component(13) is mounted on the upper side of the circuit board. A first mold unit(14) seals the electronic component and is made of non-conductive resin. A second mold unit(15) is connected to the ground pad and covers a vent and the first mold unit. |
| format | Patent |
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| language | eng ; kor |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | HIGH FREQUENCY PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
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