SOLDER RESIST COMPOSITION COMPRISING ALKALI DEVELOPABLE MODIFIED ACRYLIC COPOLYMER

PURPOSE: A photosensitive solder resist composition is provided to obtain excellent development property, miscibility, and dispersibility and to have superior strength, flexibility, and heat resistance by including an alkali developable modified acrylic copolymer. CONSTITUTION: A photosensitive sold...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI, HYEONG UK, JANG, SUNG CHEOL, LEE, AN SEOP, GWON, BO SEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	PURPOSE: A photosensitive solder resist composition is provided to obtain excellent development property, miscibility, and dispersibility and to have superior strength, flexibility, and heat resistance by including an alkali developable modified acrylic copolymer. CONSTITUTION: A photosensitive solder resist composition includes an alkali developable modified acrylic copolymer, a photopolymerization initiator, a thermal curable epoxy resin, an amine-based thermal catalyst, reaction diluents, and filler. The alkali developable modified acrylic copolymer is manufactured through a reaction of a photo-curable alkali developable polyfunctional oligomer and the alkali developable modified acrylic copolymer.