DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE AND METHODS OF MANUFACTURE

An integrated power device module having a leadframe structure with first and second spaced pads and one or more common source-drain leads located between said first and second pads, first and second transistors flip chip attached respectively to said first and second pads, wherein the source of sai...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MADRID RUBEN, NOQUIL JONATHAN A
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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