PROCESS FOR REMOVING MATERIAL FROM SUBSTRATES
A method of removing materials, and preferably photoresist, from a substrate (18) comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/ sulfuric acid molar ratio of no greater than 5:1 onto an material coate...
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| creator | RUETHER PATRICIA ANN WAGENER THOMAS J HANESTAD RONALD J CHRISTENSON KURT KARL |
| description | A method of removing materials, and preferably photoresist, from a substrate (18) comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/ sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 9O°C, either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 9O°C, the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material. |
| format | Patent |
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The substrate is preferably heated to a temperature of at least about 9O°C, either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 9O°C, the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. 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The substrate is preferably heated to a temperature of at least about 9O°C, either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 9O°C, the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. 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The substrate is preferably heated to a temperature of at least about 9O°C, either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 9O°C, the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR NOZZLES ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | PROCESS FOR REMOVING MATERIAL FROM SUBSTRATES |
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