METHOD TO REMOVE CIRCUIT PATTERNS FROM A WAFER

A method holds a wafer 206 that contains patterned structures using a particle blasting tool 200. Next, the method directs particles at the patterned structures, such that the particles contact the patterned structures with a predetermined velocity and remove the patterned structures. This process o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DOMINA DAVID, KRYWANCZYK TIMOTHY, CODDING STEVEN R, HARDY JAMES L
Format:	Patent
Sprache:	eng
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GRINDING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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