IMAGE SENSOR MODULE, METHOD OF MANUFACTURING THE SAME, CAMERA MODULE INCLUDING THE SAME AND ELECTRONIC DEVICE INCLUDING A CAMERA MODULE

IMAGE SENSOR MODULE, METHOD OF MANUFACTURING THE SAME, CAMERA MODULE INCLUDING THE SAME AND ELECTRONIC DEVICE INCLUDING A CAMERA MODULE

An image sensor module, a manufacturing method thereof, a camera module including the same and an electronic device including the camera module are provided to implement the image sensor module having the automatic focus function. An image sensor(110) has a photo diode to which the light is income a...

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1. Verfasser: KONG, YUNG CHEOL
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description An image sensor module, a manufacturing method thereof, a camera module including the same and an electronic device including the camera module are provided to implement the image sensor module having the automatic focus function. An image sensor(110) has a photo diode to which the light is income and the driving voltage is applied. A thickness variant part(130) is arranged on the image sensor in order to be adjacent to the photo diode. The thickness variant part has the thickness varied to the optical axis of the light according to the driving voltage received from the image sensor. A lens(140) is arranged on the thickness variant part and moves to the optical axis according to the thickness of thickness variant part. The image sensor comprises a substrate(111), a connection terminal(121), a bonding pad(125) and a penetrating electrode(127). The thickness variant part has the ring shape covering a plurality of bonding pads.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title IMAGE SENSOR MODULE, METHOD OF MANUFACTURING THE SAME, CAMERA MODULE INCLUDING THE SAME AND ELECTRONIC DEVICE INCLUDING A CAMERA MODULE
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