A LIGHT-EMITTING DIODE MODULE WITH A LEAD FRAME COMPRISING PACKAGES

A LIGHT-EMITTING DIODE MODULE WITH A LEAD FRAME COMPRISING PACKAGES

A light emitting diode module using a lead frame including packages is provided to radiate directly heat generated from a light emitting diode chip by mounting a light emitting diode package in a mounting hole of a resin substrate. A light emitting diode module(150) includes a chip bonding pad, a le...

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Hauptverfasser: AHN, CHANG JOON, PARK, CHAN IK
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator AHN, CHANG JOON
PARK, CHAN IK
description A light emitting diode module using a lead frame including packages is provided to radiate directly heat generated from a light emitting diode chip by mounting a light emitting diode package in a mounting hole of a resin substrate. A light emitting diode module(150) includes a chip bonding pad, a lead, a plastic body(122), a cooling fin, a resin substrate(141), and a package mounting hole(143). A light emitting diode chip is loaded on the chip bonding pad. The lead is electrically connected with the light emitting diode chip. The lead includes an inner lead(112a) insulated from the chip bonding pad and an outer lead(112b) extended from the inner lead. The plastic body is molded around the chip bonding pad in order to fix the chip bonding pad and the lead and to protrude the outer lead to the outside. A heat radiating plate is protruded to the outside of the plastic body. A circuit(142) is patterned on both sides of the resin substrate(141). The circuit is electrically connected with the outer lead. The package mounting hole is formed by punching the resin substrate. The plastic body is mounted in the package mounting hole.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title A LIGHT-EMITTING DIODE MODULE WITH A LEAD FRAME COMPRISING PACKAGES
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