LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING/RECEIVING DEVICE

LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING/RECEIVING DEVICE

A lead frame, a manufacturing method thereof, and a light receiving/emitting device are provided to prevent thermal degradation of a property by covering a reflective layer by a feature maintaining layer. A metal layer(20) is formed on a surface of a substrate(10). A reflective layer(30) is formed o...

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Hauptverfasser: MITA MAMORU, KAWANOBE TADASHI, OHNUMA YUICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MITA MAMORU
KAWANOBE TADASHI
OHNUMA YUICHI
description A lead frame, a manufacturing method thereof, and a light receiving/emitting device are provided to prevent thermal degradation of a property by covering a reflective layer by a feature maintaining layer. A metal layer(20) is formed on a surface of a substrate(10). A reflective layer(30) is formed on a part of a surface of the metal layer. A feature maintaining layer(40) is formed on the reflective layer in order to cover the reflective layer. A barrier layer(22) is formed on a surface of the substrate. A contacting layer(24) is formed on the barrier layer, and between the reflective layer and the feature maintaining layer. The feature maintaining layer includes a device mounting region(40a), an external region(40b), and a connection region(40c). The reflection layer includes Ag.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LEAD FRAME AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING/RECEIVING DEVICE
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