SPUTTERING APPARATUS
A sputtering device is provided to improve productivity of semiconductor device or a flat panel display in case of being used in manufacture of the semiconductor device or the flat panel display. A sputtering device contains process chambers(110,120) for a sputtering process, a first target tub(130)...
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| creator | CHOI, SUNG RYONG |
| description | A sputtering device is provided to improve productivity of semiconductor device or a flat panel display in case of being used in manufacture of the semiconductor device or the flat panel display. A sputtering device contains process chambers(110,120) for a sputtering process, a first target tub(130) and a second target tub(140). The first tub and the second target are installed at inside or outside of the process chamber part and includes one or more targets. The sputtering device includes shutter(150,160) covering the surface of the target tub. |
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A sputtering device contains process chambers(110,120) for a sputtering process, a first target tub(130) and a second target tub(140). The first tub and the second target are installed at inside or outside of the process chamber part and includes one or more targets. 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The sputtering device includes shutter(150,160) covering the surface of the target tub.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJDggNCXEN8vRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGBpYGBiZGhgZmjsbEqQIADbQfrQ</recordid><startdate>20090429</startdate><enddate>20090429</enddate><creator>CHOI, SUNG RYONG</creator><scope>EVB</scope></search><sort><creationdate>20090429</creationdate><title>SPUTTERING APPARATUS</title><author>CHOI, SUNG RYONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20090042106A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI, SUNG RYONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI, SUNG RYONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SPUTTERING APPARATUS</title><date>2009-04-29</date><risdate>2009</risdate><abstract>A sputtering device is provided to improve productivity of semiconductor device or a flat panel display in case of being used in manufacture of the semiconductor device or the flat panel display. A sputtering device contains process chambers(110,120) for a sputtering process, a first target tub(130) and a second target tub(140). The first tub and the second target are installed at inside or outside of the process chamber part and includes one or more targets. The sputtering device includes shutter(150,160) covering the surface of the target tub.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SPUTTERING APPARATUS |
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