METHOD OF MODIFYING SURFACE OF POLYIMIDE RESIN LAYER AND PROCESS FOR PRODUCING METAL-CLAD LAMINATE
A method of polyimide resin layer surface treatment which enables printed wiring boards to retain an adhesion strength sufficient for pitch reduction and can conform to extreme thickness reduction in insulating resin layers; and a process for producing a metal-clad laminate. The method of treating a...
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| creator | HAYASHIDA HIROYUKI MATSUMURA YASUFUMI KAWASATO HIRONOBU SHINTA RYUZO |
| description | A method of polyimide resin layer surface treatment which enables printed wiring boards to retain an adhesion strength sufficient for pitch reduction and can conform to extreme thickness reduction in insulating resin layers; and a process for producing a metal-clad laminate. The method of treating a surface of a polyamide resin layer comprises a step in which the surface of the polyimide resin layer is modified with an aqueous alkali solution and a step in which a polar solution containing an amino compound such as an aromatic amino compound or diaminosiloxane is applied to the modified surface of the polyimide resin layer and is dried to form a layer treated with the amino compound. The method may further include a step in which the amino-compound-treated layer on the polyimide resin layer is imidized. A metal foil is thermally press-bonded to or a metal is vapor-deposited on the surface-treated polyimide resin layer to obtain a metal-clad laminate. Two such surface-treated polyimide resin layers are thermally press-bonded to obtain a polyimide resin laminate. |
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The method of treating a surface of a polyamide resin layer comprises a step in which the surface of the polyimide resin layer is modified with an aqueous alkali solution and a step in which a polar solution containing an amino compound such as an aromatic amino compound or diaminosiloxane is applied to the modified surface of the polyimide resin layer and is dried to form a layer treated with the amino compound. The method may further include a step in which the amino-compound-treated layer on the polyimide resin layer is imidized. A metal foil is thermally press-bonded to or a metal is vapor-deposited on the surface-treated polyimide resin layer to obtain a metal-clad laminate. 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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | METHOD OF MODIFYING SURFACE OF POLYIMIDE RESIN LAYER AND PROCESS FOR PRODUCING METAL-CLAD LAMINATE |
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