EMI SHIELD FILM AND THE MANUFACTURING METHOD THEREOF

An EMI shield film and a manufacturing method thereof are provided to shield external light and improve luminance by forming an unevenness pattern on material. An EMI shield film comprises an unevenness pattern(210) and a conductive material(230). The unevenness pattern is formed on a film material(...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, YEON SOO, SONG, HIRN ILL, YOO, SANG HYUN, JI, SEONG DAE, HAN, DAE MAN, KIM, YONG MIN, SUNG, MYUNG SEOK
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY PERFORMING OPERATIONS PRINTED CIRCUITS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING
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Beschreibung
Zusammenfassung:	An EMI shield film and a manufacturing method thereof are provided to shield external light and improve luminance by forming an unevenness pattern on material. An EMI shield film comprises an unevenness pattern(210) and a conductive material(230). The unevenness pattern is formed on a film material(100) for shielding external light. The conductive material is filled in the unevenness pattern. The diameter of the unevenness pattern becomes smaller from the incident direction of external light(400) to the inside of the panel. The unevenness pattern has a triangular shape. The unevenness pattern is formed on the film into a black conductive layer pattern. The edge for grounding the shielded electromagnetic wave is formed in both sides of the unevenness pattern. The conductive material filled in the unevenness pattern is copper or carbon nanotube.