EQUIPMENT FOR POLISHING WAFER SEMICONDUCTOR AND DUAL HEAD PAD CONDITIONER OF EQUIPMENT THEREOF

EQUIPMENT FOR POLISHING WAFER SEMICONDUCTOR AND DUAL HEAD PAD CONDITIONER OF EQUIPMENT THEREOF

The apparatus of polishing semiconductor wafer and the dual head pad conditioner of the same are provided to control easily the conditioner sweep by using 200mm size of the diamond disc during the conditioning of the polishing pad for 300mm wafer. The polishing head(50) vacuum-absorbs the wafer. The...

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1. Verfasser: AHN, BYUNG CHAN
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description The apparatus of polishing semiconductor wafer and the dual head pad conditioner of the same are provided to control easily the conditioner sweep by using 200mm size of the diamond disc during the conditioning of the polishing pad for 300mm wafer. The polishing head(50) vacuum-absorbs the wafer. The motor rotates the polishing head. The polishing pad(56). It is installed at the lower part of the polishing head and polishes the wafer. The platen fixes the polishing pad. The first and second pad conditioners (70,72) is separately installed with the constant interval and maintain the surface state of the polishing pad.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title EQUIPMENT FOR POLISHING WAFER SEMICONDUCTOR AND DUAL HEAD PAD CONDITIONER OF EQUIPMENT THEREOF
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