PACKAGE FOR LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE, AND MANUFACTURING METHOD OF PACKAGE FOR LIGHT-EMITTING DIODE

PACKAGE FOR LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE, AND MANUFACTURING METHOD OF PACKAGE FOR LIGHT-EMITTING DIODE

The heat radiation of the package for the light emitting diode or the light emitting diode can be improved. Additionally, making thin can be achieved. The basic body has the wiring pattern for setting up LED(1). The cover(5) has the opening for accommodating LED. In the package for the LED and the d...

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Hauptverfasser: NISIYAMA KENGO, MITSUYAMA KAZUMA, FUKAE HIROYUKI, FUKUMOTO SIGEO, KUDOU KOUJI, YAMAMOTO ITSUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NISIYAMA KENGO
MITSUYAMA KAZUMA
FUKAE HIROYUKI
FUKUMOTO SIGEO
KUDOU KOUJI
YAMAMOTO ITSUKI
description The heat radiation of the package for the light emitting diode or the light emitting diode can be improved. Additionally, making thin can be achieved. The basic body has the wiring pattern for setting up LED(1). The cover(5) has the opening for accommodating LED. In the package for the LED and the diode sticking cover to the basic body, the base body is forming by laminating the electrode layer(6) of the sheet shape and heat dissipation layer(7) of the sheet shape and the insulating layer(8) of the sheet shape. Moreover, an opening is formed on the insulating layer. The adhesion region for sticking LED to the surface of the heat dissipation layer is formed.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PACKAGE FOR LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE, AND MANUFACTURING METHOD OF PACKAGE FOR LIGHT-EMITTING DIODE
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