ISOLATED SOLDER PADS

An isolated solder pad is provided to define a contact region on a lead by controlling non-uniform stand-off height between the lead and a die in an FCOL(Flip-Chip-On-Lead). A die(320) includes a plurality of I/O pads(318) formed on an active surface thereof. A lead frame includes a plurality of lea...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BAYAN JAIME A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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