SYSTEMS AND METHODS FOR DEPOSITING CONDUCTIVE MATERIAL INTO OPENINGS IN MICROFEATURE WORKPIECES
Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir incl...
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| creator | DANDO ROSS S LAKE RICK C |
| description | Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20080055861A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20080055861A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20080055861A3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQgOEuDqK-w4GzEJVK15Bc7VGTK8m14lSKxEm0UN8fO_gATj8_fMusj7co6CJob8GhVGwjlBzAYsORhPwZDHvbGqEOwWnBQPoC5IWBG_QziPOBIxO4RC1tQLhyqBtCg3GdLR7Dc0qbX1fZtkQx1S6N7z5N43BPr_Tp63BQqlAqz4vTXh__U19WaDR9</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEMS AND METHODS FOR DEPOSITING CONDUCTIVE MATERIAL INTO OPENINGS IN MICROFEATURE WORKPIECES</title><source>esp@cenet</source><creator>DANDO ROSS S ; LAKE RICK C</creator><creatorcontrib>DANDO ROSS S ; LAKE RICK C</creatorcontrib><description>Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080619&DB=EPODOC&CC=KR&NR=20080055861A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080619&DB=EPODOC&CC=KR&NR=20080055861A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DANDO ROSS S</creatorcontrib><creatorcontrib>LAKE RICK C</creatorcontrib><title>SYSTEMS AND METHODS FOR DEPOSITING CONDUCTIVE MATERIAL INTO OPENINGS IN MICROFEATURE WORKPIECES</title><description>Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEuDqK-w4GzEJVK15Bc7VGTK8m14lSKxEm0UN8fO_gATj8_fMusj7co6CJob8GhVGwjlBzAYsORhPwZDHvbGqEOwWnBQPoC5IWBG_QziPOBIxO4RC1tQLhyqBtCg3GdLR7Dc0qbX1fZtkQx1S6N7z5N43BPr_Tp63BQqlAqz4vTXh__U19WaDR9</recordid><startdate>20080619</startdate><enddate>20080619</enddate><creator>DANDO ROSS S</creator><creator>LAKE RICK C</creator><scope>EVB</scope></search><sort><creationdate>20080619</creationdate><title>SYSTEMS AND METHODS FOR DEPOSITING CONDUCTIVE MATERIAL INTO OPENINGS IN MICROFEATURE WORKPIECES</title><author>DANDO ROSS S ; LAKE RICK C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20080055861A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>DANDO ROSS S</creatorcontrib><creatorcontrib>LAKE RICK C</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DANDO ROSS S</au><au>LAKE RICK C</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEMS AND METHODS FOR DEPOSITING CONDUCTIVE MATERIAL INTO OPENINGS IN MICROFEATURE WORKPIECES</title><date>2008-06-19</date><risdate>2008</risdate><abstract>Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SYSTEMS AND METHODS FOR DEPOSITING CONDUCTIVE MATERIAL INTO OPENINGS IN MICROFEATURE WORKPIECES |
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