PACKAGE FOR LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING DIODE

PACKAGE FOR LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING DIODE

A package for a light-emitting diode, a manufacturing method thereof, and the light-emitting diode are provided to improve a radiation characteristic of a base body by forming a sheet-shaped insulating layer between a sheet-shaped electrode layer and a sheet-shaped radiation layer. A package for a l...

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Hauptverfasser: NISIYAMA KENGO, MITSUYAMA KAZUMA, FUKAE HIROYUKI, FUKUMOTO SIGEO, KUDOU KOUJI, YAMAMOTO ITSUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NISIYAMA KENGO
MITSUYAMA KAZUMA
FUKAE HIROYUKI
FUKUMOTO SIGEO
KUDOU KOUJI
YAMAMOTO ITSUKI
description A package for a light-emitting diode, a manufacturing method thereof, and the light-emitting diode are provided to improve a radiation characteristic of a base body by forming a sheet-shaped insulating layer between a sheet-shaped electrode layer and a sheet-shaped radiation layer. A package for a light-emitting diode includes a base body(4) and a cover body(5). The base body includes a wiring pattern on which a light-emitting diode element is mounted. The cover body includes an opening into which the light-emitting diode element is loaded. The base body is formed by stacking a sheet-shaped electrode layer(6), a sheet-shaped radiation layer(7), and a sheet-shaped insulating layer(8) formed between the sheet-shaped electrode layer and the sheet-shaped radiation layer. An opening is formed at the insulating layer in order to form an adhesive region for attaching the light-emitting diode element on a surface of the radiation layer.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PACKAGE FOR LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING DIODE
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