PACKAGE FOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE USING PACKAGE FOR LIGHT EMITTING DIODE

A method for manufacturing a package for light emitting diode is provided to align correctly a wiring pattern of a base plate and an opening of a cover plate by reducing an area of a base plate in comparison with an area of a cover plate. A package for light emitting diode include a base body(4) hav...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NISIYAMA KENGO, MITSUYAMA KAZUMA, FUKAE HIROYUKI, FUKUMOTO SIGEO, KUDOU KOUJI, YAMAMOTO ITSUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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