PACKAGE FOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE USING PACKAGE FOR LIGHT EMITTING DIODE

PACKAGE FOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE USING PACKAGE FOR LIGHT EMITTING DIODE

A method for manufacturing a package for light emitting diode is provided to align correctly a wiring pattern of a base plate and an opening of a cover plate by reducing an area of a base plate in comparison with an area of a cover plate. A package for light emitting diode include a base body(4) hav...

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Hauptverfasser: NISIYAMA KENGO, MITSUYAMA KAZUMA, FUKAE HIROYUKI, FUKUMOTO SIGEO, KUDOU KOUJI, YAMAMOTO ITSUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NISIYAMA KENGO
MITSUYAMA KAZUMA
FUKAE HIROYUKI
FUKUMOTO SIGEO
KUDOU KOUJI
YAMAMOTO ITSUKI
description A method for manufacturing a package for light emitting diode is provided to align correctly a wiring pattern of a base plate and an opening of a cover plate by reducing an area of a base plate in comparison with an area of a cover plate. A package for light emitting diode include a base body(4) having a wiring pattern(13) and a cover body(5) having an opening(14). The wiring pattern is formed on the base body. A light emitting diode device(3) is mounted on the wiring pattern. The light emitting diode device is mounted in the opening of the cover body. The base body and the cover body are attached to each other. A method for manufacturing the package includes a process for attaching a base plate having wiring patterns on a cover plate having a plurality of openings. The method further includes a process for dividing the base plate and the cover plate according to each of packages.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20080048903A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20080048903A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20080048903A3</originalsourceid><addsrcrecordid>eNrjZGgPcHT2dnR3VXDzD1Lw8XT3CFFw9fUMCfH0c1dw8fR3cVVw9HNR8HUN8fB3AavxdfQLdXN0DgkNAikJ8XBVCHb0ddUBK8OqPzQYxCZkDQ8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstifcOMjIwsDAwMLGwNDB2NCZOFQB4gT4J</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PACKAGE FOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE USING PACKAGE FOR LIGHT EMITTING DIODE</title><source>esp@cenet</source><creator>NISIYAMA KENGO ; MITSUYAMA KAZUMA ; FUKAE HIROYUKI ; FUKUMOTO SIGEO ; KUDOU KOUJI ; YAMAMOTO ITSUKI</creator><creatorcontrib>NISIYAMA KENGO ; MITSUYAMA KAZUMA ; FUKAE HIROYUKI ; FUKUMOTO SIGEO ; KUDOU KOUJI ; YAMAMOTO ITSUKI</creatorcontrib><description>A method for manufacturing a package for light emitting diode is provided to align correctly a wiring pattern of a base plate and an opening of a cover plate by reducing an area of a base plate in comparison with an area of a cover plate. A package for light emitting diode include a base body(4) having a wiring pattern(13) and a cover body(5) having an opening(14). The wiring pattern is formed on the base body. A light emitting diode device(3) is mounted on the wiring pattern. The light emitting diode device is mounted in the opening of the cover body. The base body and the cover body are attached to each other. A method for manufacturing the package includes a process for attaching a base plate having wiring patterns on a cover plate having a plurality of openings. The method further includes a process for dividing the base plate and the cover plate according to each of packages.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20080603&amp;DB=EPODOC&amp;CC=KR&amp;NR=20080048903A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20080603&amp;DB=EPODOC&amp;CC=KR&amp;NR=20080048903A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NISIYAMA KENGO</creatorcontrib><creatorcontrib>MITSUYAMA KAZUMA</creatorcontrib><creatorcontrib>FUKAE HIROYUKI</creatorcontrib><creatorcontrib>FUKUMOTO SIGEO</creatorcontrib><creatorcontrib>KUDOU KOUJI</creatorcontrib><creatorcontrib>YAMAMOTO ITSUKI</creatorcontrib><title>PACKAGE FOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE USING PACKAGE FOR LIGHT EMITTING DIODE</title><description>A method for manufacturing a package for light emitting diode is provided to align correctly a wiring pattern of a base plate and an opening of a cover plate by reducing an area of a base plate in comparison with an area of a cover plate. A package for light emitting diode include a base body(4) having a wiring pattern(13) and a cover body(5) having an opening(14). The wiring pattern is formed on the base body. A light emitting diode device(3) is mounted on the wiring pattern. The light emitting diode device is mounted in the opening of the cover body. The base body and the cover body are attached to each other. A method for manufacturing the package includes a process for attaching a base plate having wiring patterns on a cover plate having a plurality of openings. The method further includes a process for dividing the base plate and the cover plate according to each of packages.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGgPcHT2dnR3VXDzD1Lw8XT3CFFw9fUMCfH0c1dw8fR3cVVw9HNR8HUN8fB3AavxdfQLdXN0DgkNAikJ8XBVCHb0ddUBK8OqPzQYxCZkDQ8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstifcOMjIwsDAwMLGwNDB2NCZOFQB4gT4J</recordid><startdate>20080603</startdate><enddate>20080603</enddate><creator>NISIYAMA KENGO</creator><creator>MITSUYAMA KAZUMA</creator><creator>FUKAE HIROYUKI</creator><creator>FUKUMOTO SIGEO</creator><creator>KUDOU KOUJI</creator><creator>YAMAMOTO ITSUKI</creator><scope>EVB</scope></search><sort><creationdate>20080603</creationdate><title>PACKAGE FOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE USING PACKAGE FOR LIGHT EMITTING DIODE</title><author>NISIYAMA KENGO ; MITSUYAMA KAZUMA ; FUKAE HIROYUKI ; FUKUMOTO SIGEO ; KUDOU KOUJI ; YAMAMOTO ITSUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20080048903A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NISIYAMA KENGO</creatorcontrib><creatorcontrib>MITSUYAMA KAZUMA</creatorcontrib><creatorcontrib>FUKAE HIROYUKI</creatorcontrib><creatorcontrib>FUKUMOTO SIGEO</creatorcontrib><creatorcontrib>KUDOU KOUJI</creatorcontrib><creatorcontrib>YAMAMOTO ITSUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NISIYAMA KENGO</au><au>MITSUYAMA KAZUMA</au><au>FUKAE HIROYUKI</au><au>FUKUMOTO SIGEO</au><au>KUDOU KOUJI</au><au>YAMAMOTO ITSUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PACKAGE FOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE USING PACKAGE FOR LIGHT EMITTING DIODE</title><date>2008-06-03</date><risdate>2008</risdate><abstract>A method for manufacturing a package for light emitting diode is provided to align correctly a wiring pattern of a base plate and an opening of a cover plate by reducing an area of a base plate in comparison with an area of a cover plate. A package for light emitting diode include a base body(4) having a wiring pattern(13) and a cover body(5) having an opening(14). The wiring pattern is formed on the base body. A light emitting diode device(3) is mounted on the wiring pattern. The light emitting diode device is mounted in the opening of the cover body. The base body and the cover body are attached to each other. A method for manufacturing the package includes a process for attaching a base plate having wiring patterns on a cover plate having a plurality of openings. The method further includes a process for dividing the base plate and the cover plate according to each of packages.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PACKAGE FOR LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DIODE USING PACKAGE FOR LIGHT EMITTING DIODE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T02%3A07%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NISIYAMA%20KENGO&rft.date=2008-06-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20080048903A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true