SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

A semiconductor device package and a method of fabricating the same are provided to prevent bonding wires from being damaged by external physical stress by containing center bonding pads and bonding wires in a cavity of a cap-type member, thereby manufacturing a physically and electrically reliable and highly integrated semiconductor device package. A semiconductor device package comprises a printed circuit board(130), a semiconductor chip(110), a plurality of bonding wires(145), a cap-type member(150d), and a plurality of solder balls(160). A window is the center of the printed circuit board. The semiconductor chip is mounted onto the printed circuit board, exposing center bonding pads(112) through the window. The center bonding pads and the printed circuit board are electrically connected by the bonding wires through a window. The cap-type member is attached on a peripheral portion of a lower side of the printed circuit board including the window, having a cavity containing the center bonding pads and bonding wires for protection from external physical stress. The solder balls are installed on the lower side of the printed circuit board outside the cap-type member.