FAN COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS
A fan cooling unit (10) for cooling electronic components, such as for an air-cooled telecommunications base station, comprises a protective covering for at least the air inlet opening (11) of a casing (8) in which the electronic components are housed. The protective covering (1) has a frame (2) int...
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creator | POON WAI SING MULLER JASON W RUDOLF CHRISTIANE SCHWARZ ROBERT |
description | A fan cooling unit (10) for cooling electronic components, such as for an air-cooled telecommunications base station, comprises a protective covering for at least the air inlet opening (11) of a casing (8) in which the electronic components are housed. The protective covering (1) has a frame (2) into which a composite filter media (3) is mounted so as to create an air-tight fit. The composite filter media (3) comprises a membrane filtration layer (20) with a porous polymeric membrane, such as expanded polytetrafluoroethylene (ePTFE), and at least one depth filtration layer (18) disposed on an upstream side of the membrane filtration layer (20). The depth filtration media layer comprises fibers having an electrostatic charge. The ePTFE membrane is preferably made from a blend of a PTFE homopolymer and a modified PTFE polymer. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20080033961A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20080033961A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20080033961A3</originalsourceid><addsrcrecordid>eNrjZDByc_RTcPb39_H0c1cI9fMMUXDzD4ILuPq4OocE-ft5OgOFfAP8_Vz9QoJ5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5CRgYGFgYGxsaWZoaMxcaoADsMntQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FAN COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS</title><source>esp@cenet</source><creator>POON WAI SING ; MULLER JASON W ; RUDOLF CHRISTIANE ; SCHWARZ ROBERT</creator><creatorcontrib>POON WAI SING ; MULLER JASON W ; RUDOLF CHRISTIANE ; SCHWARZ ROBERT</creatorcontrib><description>A fan cooling unit (10) for cooling electronic components, such as for an air-cooled telecommunications base station, comprises a protective covering for at least the air inlet opening (11) of a casing (8) in which the electronic components are housed. The protective covering (1) has a frame (2) into which a composite filter media (3) is mounted so as to create an air-tight fit. The composite filter media (3) comprises a membrane filtration layer (20) with a porous polymeric membrane, such as expanded polytetrafluoroethylene (ePTFE), and at least one depth filtration layer (18) disposed on an upstream side of the membrane filtration layer (20). The depth filtration media layer comprises fibers having an electrostatic charge. The ePTFE membrane is preferably made from a blend of a PTFE homopolymer and a modified PTFE polymer.</description><language>eng</language><subject>PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; SEPARATION ; TRANSPORTING</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080417&DB=EPODOC&CC=KR&NR=20080033961A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080417&DB=EPODOC&CC=KR&NR=20080033961A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>POON WAI SING</creatorcontrib><creatorcontrib>MULLER JASON W</creatorcontrib><creatorcontrib>RUDOLF CHRISTIANE</creatorcontrib><creatorcontrib>SCHWARZ ROBERT</creatorcontrib><title>FAN COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS</title><description>A fan cooling unit (10) for cooling electronic components, such as for an air-cooled telecommunications base station, comprises a protective covering for at least the air inlet opening (11) of a casing (8) in which the electronic components are housed. The protective covering (1) has a frame (2) into which a composite filter media (3) is mounted so as to create an air-tight fit. The composite filter media (3) comprises a membrane filtration layer (20) with a porous polymeric membrane, such as expanded polytetrafluoroethylene (ePTFE), and at least one depth filtration layer (18) disposed on an upstream side of the membrane filtration layer (20). The depth filtration media layer comprises fibers having an electrostatic charge. The ePTFE membrane is preferably made from a blend of a PTFE homopolymer and a modified PTFE polymer.</description><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>SEPARATION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDByc_RTcPb39_H0c1cI9fMMUXDzD4ILuPq4OocE-ft5OgOFfAP8_Vz9QoJ5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakm8d5CRgYGFgYGxsaWZoaMxcaoADsMntQ</recordid><startdate>20080417</startdate><enddate>20080417</enddate><creator>POON WAI SING</creator><creator>MULLER JASON W</creator><creator>RUDOLF CHRISTIANE</creator><creator>SCHWARZ ROBERT</creator><scope>EVB</scope></search><sort><creationdate>20080417</creationdate><title>FAN COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS</title><author>POON WAI SING ; MULLER JASON W ; RUDOLF CHRISTIANE ; SCHWARZ ROBERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20080033961A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>SEPARATION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>POON WAI SING</creatorcontrib><creatorcontrib>MULLER JASON W</creatorcontrib><creatorcontrib>RUDOLF CHRISTIANE</creatorcontrib><creatorcontrib>SCHWARZ ROBERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>POON WAI SING</au><au>MULLER JASON W</au><au>RUDOLF CHRISTIANE</au><au>SCHWARZ ROBERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FAN COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS</title><date>2008-04-17</date><risdate>2008</risdate><abstract>A fan cooling unit (10) for cooling electronic components, such as for an air-cooled telecommunications base station, comprises a protective covering for at least the air inlet opening (11) of a casing (8) in which the electronic components are housed. The protective covering (1) has a frame (2) into which a composite filter media (3) is mounted so as to create an air-tight fit. The composite filter media (3) comprises a membrane filtration layer (20) with a porous polymeric membrane, such as expanded polytetrafluoroethylene (ePTFE), and at least one depth filtration layer (18) disposed on an upstream side of the membrane filtration layer (20). The depth filtration media layer comprises fibers having an electrostatic charge. The ePTFE membrane is preferably made from a blend of a PTFE homopolymer and a modified PTFE polymer.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEPARATION TRANSPORTING |
title | FAN COOLING UNIT FOR COOLING ELECTRONIC COMPONENTS |
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