TEMPERATURE MEASURING APPARATUS OF NON-CONTACT TYPE AND METHOD OF THE SAME

A non-contact type temperature measurement apparatus in RF plasma equipment is provided to enable precise temperature measurement by including a plurality of non-contact sensors in a plate of an electrostatic chuck and by using the emissivity of a wafer. A wafer(W) is loaded onto an electrostatic chuck(108). At least one non-contact sensor(110a,110b,110c) receives a wavelength emitted from the wafer, installed in the plate of the electrostatic chuck. The non-contact sensors are electrically interconnected by an optical probe. A control part(120) receives the wavelength of the wafer from the non-contact sensor via the optical probe and detects the temperature in each position of the non-contact sensors. The non-contact sensor can be made of a blackbody, and the control part can detect a temperature by using the emissivity of the blackbody.