STACK PACKAGE HAVING POLYMER BUMP, MANUFACTURING METHOD THEREOF, AND STRUCTURE MOUNTED ON MOTHER BOARD THEREOF

A stack package having a polymer bump is provided to restrain the generation of a solder junction defect between unit packages even if a solder ball is lower than an interval between circuit boards of lower and upper unit packages by forming a polymer bump on the circuit board of the lower unit package so that the polymer bump is thermo-compressively inserted into the solder ball of the upper unit package. A predetermined part of a polymer bump is inserted from a circuit board(120) of a lower unit package into a solder ball of an upper unit package to function as a medium for interconnecting the circuit board of the lower unit package and the solder ball of the upper unit package. A semiconductor chip(130) can be attached to the top surface(121) of the circuit board. The circuit board is electrically connected to the semiconductor chip by a bonding member. The bonding member and a connection region between the circuit board and the semiconductor chip can be protected by a resin molding part(150). A plurality of solder balls can be formed on the bottom surface(123) of the circuit board outside the semiconductor chip. The polymer bump can be formed on the top surface of the circuit board of the lower unit package, corresponding to the solder ball of the upper unit package.