APPARATUS AND METHOD FOR APPLYING ADHESIVE USED IN MANUFACTURING SEMICONDUCTOR PACKAGES

An apparatus and a method for applying an adhesive for semiconductor package manufacturing process are provided to prevent a die contact error by applying uniformly the constant amount of adhesive. A dispenser(102) is formed to store an adhesive(100). An opening(101) is formed at a lower end of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SONG, KYEONG JUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!