ELECTRONIC PART INSPECTION APPARATUS
An electronic part inspection device is provided to obtain an exact image of the inside of an electronic part by disposing a mirror in parallel to the inside of the electronic part within a perforated hole unit of a rotary plate. An electronic part inspection device comprises the followings: a rotar...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | PARK, JONG TAE KIM, CHUN DONG IM, YU CHEONG |
| description | An electronic part inspection device is provided to obtain an exact image of the inside of an electronic part by disposing a mirror in parallel to the inside of the electronic part within a perforated hole unit of a rotary plate. An electronic part inspection device comprises the followings: a rotary plate(11) having a perforated hole unit(11a) in the center; a suction plate(12) provided with plural suction tools(13) closely coming in contact with the underside of the rotary plate, and rotated in one direction while the rotary plate is sucked and combined; a feeder(14) supplying plural electronic parts(20) to the upside of the rotary plate; plural cameras(15~18) photographing each side of the electronic part aligned on the upside of the rotary plate; and mirrors(22~24) installed on the horizontal or vertical extension line with respect to the electronic part to provide an exact reflected image of the electronic part to the camera. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20070097909A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20070097909A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20070097909A3</originalsourceid><addsrcrecordid>eNrjZFBx9XF1Dgny9_N0VghwDApR8PQLDgCKePr7KTgGAEUcQ0KDeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGBuYGBpbmlgaWjMXGqACBfJCk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC PART INSPECTION APPARATUS</title><source>esp@cenet</source><creator>PARK, JONG TAE ; KIM, CHUN DONG ; IM, YU CHEONG</creator><creatorcontrib>PARK, JONG TAE ; KIM, CHUN DONG ; IM, YU CHEONG</creatorcontrib><description>An electronic part inspection device is provided to obtain an exact image of the inside of an electronic part by disposing a mirror in parallel to the inside of the electronic part within a perforated hole unit of a rotary plate. An electronic part inspection device comprises the followings: a rotary plate(11) having a perforated hole unit(11a) in the center; a suction plate(12) provided with plural suction tools(13) closely coming in contact with the underside of the rotary plate, and rotated in one direction while the rotary plate is sucked and combined; a feeder(14) supplying plural electronic parts(20) to the upside of the rotary plate; plural cameras(15~18) photographing each side of the electronic part aligned on the upside of the rotary plate; and mirrors(22~24) installed on the horizontal or vertical extension line with respect to the electronic part to provide an exact reflected image of the electronic part to the camera.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071005&DB=EPODOC&CC=KR&NR=20070097909A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071005&DB=EPODOC&CC=KR&NR=20070097909A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARK, JONG TAE</creatorcontrib><creatorcontrib>KIM, CHUN DONG</creatorcontrib><creatorcontrib>IM, YU CHEONG</creatorcontrib><title>ELECTRONIC PART INSPECTION APPARATUS</title><description>An electronic part inspection device is provided to obtain an exact image of the inside of an electronic part by disposing a mirror in parallel to the inside of the electronic part within a perforated hole unit of a rotary plate. An electronic part inspection device comprises the followings: a rotary plate(11) having a perforated hole unit(11a) in the center; a suction plate(12) provided with plural suction tools(13) closely coming in contact with the underside of the rotary plate, and rotated in one direction while the rotary plate is sucked and combined; a feeder(14) supplying plural electronic parts(20) to the upside of the rotary plate; plural cameras(15~18) photographing each side of the electronic part aligned on the upside of the rotary plate; and mirrors(22~24) installed on the horizontal or vertical extension line with respect to the electronic part to provide an exact reflected image of the electronic part to the camera.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBx9XF1Dgny9_N0VghwDApR8PQLDgCKePr7KTgGAEUcQ0KDeRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGBuYGBpbmlgaWjMXGqACBfJCk</recordid><startdate>20071005</startdate><enddate>20071005</enddate><creator>PARK, JONG TAE</creator><creator>KIM, CHUN DONG</creator><creator>IM, YU CHEONG</creator><scope>EVB</scope></search><sort><creationdate>20071005</creationdate><title>ELECTRONIC PART INSPECTION APPARATUS</title><author>PARK, JONG TAE ; KIM, CHUN DONG ; IM, YU CHEONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20070097909A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>PARK, JONG TAE</creatorcontrib><creatorcontrib>KIM, CHUN DONG</creatorcontrib><creatorcontrib>IM, YU CHEONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARK, JONG TAE</au><au>KIM, CHUN DONG</au><au>IM, YU CHEONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC PART INSPECTION APPARATUS</title><date>2007-10-05</date><risdate>2007</risdate><abstract>An electronic part inspection device is provided to obtain an exact image of the inside of an electronic part by disposing a mirror in parallel to the inside of the electronic part within a perforated hole unit of a rotary plate. An electronic part inspection device comprises the followings: a rotary plate(11) having a perforated hole unit(11a) in the center; a suction plate(12) provided with plural suction tools(13) closely coming in contact with the underside of the rotary plate, and rotated in one direction while the rotary plate is sucked and combined; a feeder(14) supplying plural electronic parts(20) to the upside of the rotary plate; plural cameras(15~18) photographing each side of the electronic part aligned on the upside of the rotary plate; and mirrors(22~24) installed on the horizontal or vertical extension line with respect to the electronic part to provide an exact reflected image of the electronic part to the camera.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_KR20070097909A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | ELECTRONIC PART INSPECTION APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T05%3A27%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=PARK,%20JONG%20TAE&rft.date=2007-10-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20070097909A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |