FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME

A field effect transistor, which is arranged in a semiconductor device, comprises a first and a second doped source/drain region, both regions being arranged within a semiconductor substrate on either side of a gate electrode, and a channel region formed within the substrate between both doped sourc...

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Hauptverfasser: SCHLOSSER TILL, MANGER DIRK
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MANGER DIRK
description A field effect transistor, which is arranged in a semiconductor device, comprises a first and a second doped source/drain region, both regions being arranged within a semiconductor substrate on either side of a gate electrode, and a channel region formed within the substrate between both doped source/drain regions beneath said gate electrode. A gate oxide layer is formed upon the semiconductor substrate. The gate electrode contacts a surface of the gate oxide layer and further comprises at least a first and a second conductive layer, wherein the first and second conductive layers are made of materials having different work functions with respect to each other. The first conductive layer contacts the gate oxide layer within a first portion of the surface, and the second conductive layer contacts the gate oxide layer within a second portion of the surface. The first conductive layer is further conductively connected to the second conductive layer.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20070054586A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20070054586A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20070054586A3</originalsourceid><addsrcrecordid>eNrjZLBx83T1cVFwdXNzdQ5RCAly9Av2DA7xD1Jw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBgbmBgamJqYWZo7GxKkCAI1DKjc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME</title><source>esp@cenet</source><creator>SCHLOSSER TILL ; MANGER DIRK</creator><creatorcontrib>SCHLOSSER TILL ; MANGER DIRK</creatorcontrib><description>A field effect transistor, which is arranged in a semiconductor device, comprises a first and a second doped source/drain region, both regions being arranged within a semiconductor substrate on either side of a gate electrode, and a channel region formed within the substrate between both doped source/drain regions beneath said gate electrode. A gate oxide layer is formed upon the semiconductor substrate. The gate electrode contacts a surface of the gate oxide layer and further comprises at least a first and a second conductive layer, wherein the first and second conductive layers are made of materials having different work functions with respect to each other. The first conductive layer contacts the gate oxide layer within a first portion of the surface, and the second conductive layer contacts the gate oxide layer within a second portion of the surface. The first conductive layer is further conductively connected to the second conductive layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070529&amp;DB=EPODOC&amp;CC=KR&amp;NR=20070054586A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070529&amp;DB=EPODOC&amp;CC=KR&amp;NR=20070054586A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHLOSSER TILL</creatorcontrib><creatorcontrib>MANGER DIRK</creatorcontrib><title>FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME</title><description>A field effect transistor, which is arranged in a semiconductor device, comprises a first and a second doped source/drain region, both regions being arranged within a semiconductor substrate on either side of a gate electrode, and a channel region formed within the substrate between both doped source/drain regions beneath said gate electrode. A gate oxide layer is formed upon the semiconductor substrate. The gate electrode contacts a surface of the gate oxide layer and further comprises at least a first and a second conductive layer, wherein the first and second conductive layers are made of materials having different work functions with respect to each other. The first conductive layer contacts the gate oxide layer within a first portion of the surface, and the second conductive layer contacts the gate oxide layer within a second portion of the surface. The first conductive layer is further conductively connected to the second conductive layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBx83T1cVFwdXNzdQ5RCAly9Av2DA7xD1Jw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXCPFwVQh29HXlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBgbmBgamJqYWZo7GxKkCAI1DKjc</recordid><startdate>20070529</startdate><enddate>20070529</enddate><creator>SCHLOSSER TILL</creator><creator>MANGER DIRK</creator><scope>EVB</scope></search><sort><creationdate>20070529</creationdate><title>FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME</title><author>SCHLOSSER TILL ; MANGER DIRK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20070054586A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHLOSSER TILL</creatorcontrib><creatorcontrib>MANGER DIRK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHLOSSER TILL</au><au>MANGER DIRK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME</title><date>2007-05-29</date><risdate>2007</risdate><abstract>A field effect transistor, which is arranged in a semiconductor device, comprises a first and a second doped source/drain region, both regions being arranged within a semiconductor substrate on either side of a gate electrode, and a channel region formed within the substrate between both doped source/drain regions beneath said gate electrode. A gate oxide layer is formed upon the semiconductor substrate. The gate electrode contacts a surface of the gate oxide layer and further comprises at least a first and a second conductive layer, wherein the first and second conductive layers are made of materials having different work functions with respect to each other. The first conductive layer contacts the gate oxide layer within a first portion of the surface, and the second conductive layer contacts the gate oxide layer within a second portion of the surface. The first conductive layer is further conductively connected to the second conductive layer.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T10%3A16%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SCHLOSSER%20TILL&rft.date=2007-05-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20070054586A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true