PRINTED CIRCUIT BOARD MAKING METHOD

A PCB(Printed Circuit Board) fabrication method is provided to previously prevent formation of a dendrite and relatively reduce a defective rate of the PCB by not exposing a circuit pattern or a wire bonding pad on a cut surface generated by routing or punching. A PCB making method includes the steps of: forming at least a wire bonding pad(24) and a ball pad(26) to be exposed to the surface of the PCB(20); forming an electroless plating layer(30) on the wire bonding pad(24) and the ball pad(26); forming a conductive coating layer on the surface of the PCB(20) having the bonding pad(24) and the ball pad(26); exposing the wire bonding pad(24) by removing a part of the conductive coating layer except a region where the wire bonding pad(24) is formed in a state of shielding the conductive coating layer with a mask; performing plating by supplying power onto the wire bonding pad(24) through the conductive coating layer; and removing the mask and the conductive coating layer.